Tony Lentz Presents at SMTA International 2023
FCT Solder’s Tony Lentz presented his research ‘Fill the Void VI: A Study of the Impact of Solder Alloy on Voiding in Solder Joints’ last week at the SMTA International expo and conference that was held in Minneapolis.
Well done, Tony!
To learn more, check out the paper and presentation here.
Fill the Void VI: A Study of the Impact of Solder Alloy on Voiding in Solder Joints – Presentation by Tony Lentz!
Voiding in solder joints is an ongoing concern for printed circuit board assembly (PCBA) manufacturers and original equipment manufacturers (OEMs). Voiding can lead to electrical circuit interference, thermal dissipation issues, and potential mechanical weakness in the solder joint. This presentation explores the influence of solder paste flux, solder alloy, solder powder size, stencil design, and reflow profile on voiding in solder joints. Void data from prior work will be presented, and recommendations made to minimize voiding potential.
About Tony Lentz
Tony Lentz began working in the electronics industry in 1994. He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years. Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer. Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. He has written and presented many papers at industry events. Tony is the chair of the IPC J-STD-004 task group and vice-chair of the IPC J-STD-005 task group. He is a speaker of distinction with SMTA and holds B.S. and M.B.S. degrees in Chemistry.