FCT Solder is excited to announce that we will be co-exhibiting at productronica this year with Stannol! We look forward to seeing all of the amazing tech innovations there, as well as exhibiting some of our own!
FCT Solder’s Tony Lentz presented his research ‘Fill the Void VI: A Study of the Impact of Solder Alloy on Voiding in Solder Joints’ last week at the SMTA International expo and conference that was held in Minneapolis. Well done, Tony! To learn more, check out the paper and presentation here.