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Top PCB Assemblers Choose These Solder Pastes
for Their Surface Finishes

Download our FREE Whitepaper to Learn More

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What will you discover?

  • The optimal solder paste for various surface finishes, including tin-lead HASL, lead-free HASL, OSP, and more.

  • The performance differences of high-caliber solder paste.

  • Important characteristics necessary for surface finishes, besides the standard print and reflow requirements. 

  • The overall effect of surface finishes on solder paste performance.

Learn More About Our Solder Pastes

Solder Paste for Surface Finishes Download

AmpOne Solder

The AMP One solder paste from FCT Solder is redefining the voiding standard for PCB Assembly. By combining industry low levels of voiding performance with excellent activity and decreasing the potential for solder balling and graping, AMP One delivers assemblers an unmatched ability to amplify their process window while ultimately achieving higher yields.

This solder paste can easily be used on the printer for up to 8 hours. It also tolerates pauses in printing very well. After a pause of 8 hours, this paste prints normally without kneading.

Learn more about AmpOne Solder.

Solder Paste for Surface Finishes Download

Lead Free Solder

We utilize common lead free alloys (SAC305, SN100C®, Sn96.5/Ag3.5) and combine them with our industry-leading flux technology. Our research and development chemists have over 100 years of combined experience formulating soldering fluxes. Our lead free solder pastes are environmentally stable which prolongs shelf life, stencil life, and board life. It also performs exceptionally well in the print process.

View our various lead free solders here.

Solder Paste for Surface Finishes Download

Leaded Solder

FCT Solder has leaded solder paste with different attributes including, halogen-free chemistry with IPC specification of ROL0 offering a highly reliable solder joint, excellent print volume and repeatability with low area ratios (AR) as low as 0.50 when used with the NanoSlic stencil technology, and even low viscosity with low slump characteristics allow for fast printing and improved transfer efficiency.

View our various leaded solders here.