Top PCB Assemblers Choose These Solder Pastes
for Their Surface Finishes
Download our FREE Whitepaper to Learn More
What will you discover?
The optimal solder paste for various surface finishes, including tin-lead HASL, lead-free HASL, OSP, and more.
The performance differences of high-caliber solder paste.
Important characteristics necessary for surface finishes, besides the standard print and reflow requirements.
The overall effect of surface finishes on solder paste performance.
Learn More About Our Solder Pastes
The AMP One solder paste from FCT Solder is redefining the voiding standard for PCB Assembly. By combining industry low levels of voiding performance with excellent activity and decreasing the potential for solder balling and graping, AMP One delivers assemblers an unmatched ability to amplify their process window while ultimately achieving higher yields.
This solder paste can easily be used on the printer for up to 8 hours. It also tolerates pauses in printing very well. After a pause of 8 hours, this paste prints normally without kneading.
Lead Free Solder
We utilize common lead free alloys (SAC305, SN100C®, Sn96.5/Ag3.5) and combine them with our industry-leading flux technology. Our research and development chemists have over 100 years of combined experience formulating soldering fluxes. Our lead free solder pastes are environmentally stable which prolongs shelf life, stencil life, and board life. It also performs exceptionally well in the print process.
FCT Solder has leaded solder paste with different attributes including, halogen-free chemistry with IPC specification of ROL0 offering a highly reliable solder joint, excellent print volume and repeatability with low area ratios (AR) as low as 0.50 when used with the NanoSlic stencil technology, and even low viscosity with low slump characteristics allow for fast printing and improved transfer efficiency.