AMP One Ultra Low Voiding Solder Paste

AMP One Ultra Low Voiding Solder Paste

The AMP One solder paste from FCT Assembly, is redefining the voiding standard for PCB Assembly. By combining industry low levels of voiding performance with excellent activity and decreasing the potential for solder balling and graping, AMP One delivers assemblers an unmatched ability to amplify their process window while ultimately achieving higher yields.

AMP One Ultra Low Voiding Solder Paste

Ultra-Low Voiding

Third party studies on voiding show that AMP One provides lower voiding than comparable no clean lead-free solder pastes. This is due to proprietary additives that enhance the de-gassing ability of the solder paste. These special additives allow gas bubbles to escape from the solder joints before solidification resulting in ultra low voiding.

Excellent Stencil Life & Response to Pause

AMP One solder paste has been formulated to provide much longer stencil life than comparable no clean lead-free solder pastes. AMP One can easily be used on the printer for up to 8 hours. AMP One solder paste also tolerates pauses in printing very well. After a pause of 8 hours AMP One printed normally without kneading.

Superior Reflow Characteristics

AMP One solder paste produces top of the line reflow performance. Wetting is excellent, solder balling is very low and graping is best in class. AMP One tolerates a wide range of reflow profiles.

AMP One Properties:

  • Low Solder Balling
  • Halide and Halogen Free
  • Excellent Wetting
  • High Activity
  • Long Stencil Life
AMP One Ultra Low Voiding Solder Paste

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