Lead Free Solder Paste

Attributes
Flux Type
Alloys
Classification
Halogen
AMP One
No Clean
Lead Free
ROL0
No
NL930PT
No Clean
Lead Free
ROL0
No
NL932HF
No Clean
Lead Free
ROL0
No
WS890
Water Soluble
Lead Free
ORH1
Yes
Attributes
Flux Type
Alloys
Classification
Halogen
WS889
Water Soluble
Lead Free
ORH1
Yes
WS888
Water Soluble
Lead Free
ORH0
Yes
NC722
No Clean
Low melting lead free, tin bismuth alloys
ROL0
Yes

The AMP One solder paste combines industry low levels of voiding performance with excellent activity and decreases the potential for solder balling and graping.

Flux Type: No Clean
Alloys: Lead-Free
Classification: ROL0
Halogen: No

NL930PT is a halogen free, lead free, no clean solder paste that is pin probable. When combined with NanoSlic technology, this paste delivers area ratio (AR) paste transfer efficiencies below 0.50 respectively.

Flux Type: No Clean
Alloys: Lead-Free
Classification: ROL0
Halogen: No

NL932HF is a halide free, lead free, no clean solder paste that allows for repeatability and consistency. This paste is formulated to deliver exceptional cosmetics, especially when used in conjunction with Nihon Superior’s SN100C patented lead free alloy. This product was designed to minimize graping issues in the reflow process.

Flux Type: No Clean
Alloys: Lead-Free
Classification: ROL0
Halogen: No

WS890 is an excellent all-around water soluble, lead-free solder paste. It has superior reflow characteristics giving excellent wetting, very low solder balling, and very low graping. WS890 has been formulated for environmental stability giving long stencil life and excellent print characteristics.

Flux type: Water Soluble
Alloys: Lead Free
Classification: ORH1
Halogen: Yes

WS889 water soluble lead free solder paste is formulated to provide minimal graping and excellent wetting qualities. WS889 displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65-85 F) and relative humidity (25-65 % RH). Residues are amber in color and can be cleaned using warm water.

Flux Type: Water Soluble
Alloys: Lead-Free
Classification: ORH1
Halogen: Yes

WS888 water soluble lead free solder paste is designed to meet the requirements for reliable solder joints in the PCB assemblies. WS888 displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65-85F) and relative humidity (25-65% RH). WS888 residues clean easily using warm water.

Flux Type: Water Soluble
Alloys: Lead-Free
Classification: ORH1
Halogen: Yes

NC722 is a no-clean, low melting lead-free solder paste. NC722 is designed specifically for use with low melting, tin-bismuth alloys. NC722 is halide free, has excellent stencil life and is usable in a wide range of environmental conditions. NC722 flux residues are clear and pin testable. NC722 is classified ROL0.

Flux Type: No Clean
Alloys: Low melting lead free, tin bismuth alloys
Classification: ROL0
Halogen: Yes

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About Our Lead Free Solder Pastes

FCT Assembly manufactures and sells high performance lead free solder pastes for electronics assembly. Our products are intended for use soldering components onto circuit boards in the surface mount process. We utilize common lead free alloys (SAC305, SN100C®, Sn96.5/Ag3.5) and combine them with our industry leading flux technology. Our research and development chemists have over 100 years of combined experience formulating soldering fluxes.

The lead free era in electronics manufacturing accelerated with the advent of the EU’s RoHS (Restriction of Hazardous Substances) in 2006. This law forced electronics manufacturers to use lead free solders in their process. SAC305 was adopted early on as the lead free alloy of choice. SAC305 has lost some popularity in wave and selective soldering applications, but remains the most popular lead free alloy for solder paste. SN100C® is now the industry leading alloy for wave and selective soldering, and has some market share in solder paste applications. Alternate lead free alloys like Sn96.5/Ag3.5 are used in solder paste for specific applications which is driven by customer needs.

Lead free solder pastes differ in formulation from leaded solder pastes. Leaded solder pastes are formulated to work at lower reflow temperatures than their lead free counterparts. This is due to the difference in melting points of Sn63/Pb37 (183 ºC) and typical lead free alloys (217 – 227 ºC). Leaded solder pastes use ingredients that could evaporate or “burn off” in a lead free reflow profile. Lead free solder paste fluxes are usually more active than leaded solder paste fluxes.

The solvents and other ingredients in lead free solder pastes typically have higher boiling points than leaded solder pastes. Regardless of these differences in solder paste fluxes, many lead free solder paste out-perform their leaded counter parts. Leaded solder paste technology has fallen behind the newer, more advanced lead free solder pastes.

FCT Assembly lead free solder pastes are environmentally stable which prolongs shelf life, stencil life, and board life. Our solder pastes perform exceptionally well in the print process.

Stencil life is optimized to allow for the complete use of our solder paste in order to minimize waste. FCT Assembly formulates solder pastes with exceptional reflow performance. Wetting, solder balling, graping, and voiding performance are all optimized. We offer solder pastes that are specially formulated to minimize voiding beyond the already low levels offered by our standard products.

FCT Assembly makes solder paste fresh to order. Our standard lead time is 3-4 working days. This ensures that your solder paste has its full shelf life which is 9 months for most of our products. We also work with several distributors who can stock products in your area. Contact your local FCT Assembly representative for details.

FCT Assembly is happy to provide samples of our solder pastes for testing. We simply ask for feedback on how they work for you. We are conscientious of our customer’s needs and strive to continually improve our products in order to exceed expectations.

Restriction of Hazardous Substances (RoHS)

The usage of lead free solder in electronics accelerated with the implementation of the European Union’s Directive 2002/95/EC on the Restriction of Hazardous Substances (RoHS).  These laws took effect on July 1, 2006.  The restricted substances included in RoHS are shown below.

Restricted Substance1


The intention of RoHS is to reduce the amount of these substances introduced to the environment. This forced many electronics manufacturers to use solders that are free of lead, mercury, and cadmium. Most lead free solders are based on tin (Sn) and contain a trace amount of lead (Pb) that is below the RoHS limit (1000 ppm = 0.1 % wt). Mercury and cadmium are not normally found in pure tin metal.

The process of using lead free solders requires higher temperatures than lead bearing solders.  This is due to the higher melting points of most tin based lead free solders, which are shown below.  

Lead Free Solder Alloys1

In most cases the melting point of lead free solders is 35 to 40 °C higher than Sn63/Pb37 solder. Lead free solders require higher temperatures in wave, selective, hand, and reflow soldering. The fluxes, circuit boards, and components used must be able to handle this additional heat.

Since the implementation of RoHS, soldering fluxes have been developed to give excellent performance with lead free solders. FCT Assembly manufactures and sells a wide variety of lead free soldering products. These include wire solder, bar solder, liquid flux, gel flux, and solder pastes.

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