FCT Solder FAE, Tony Lentz, is part of an upcoming FREE discussion panel. Register to join in on October 6 at 10:45 AM EST to learn about advanced print and paste deposition techniques. Achieving 100% paste volume in the print process directly correlates to solder joint reliability. This panel will discuss the do’s and don’ts of printer setup, stencil design, and paste deposition to increase solder joint reliability in the assembly process.
Tony has extensive experience doing research and development, quality control, and technical services with products used to manufacture and assemble printed circuit boards. He has published and presented many papers at industry events and is a Speaker of Distinction with SMTA.