Listen to “Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction” on Spreaker. Tune in to Episode 32 of Mike Konrad’s podcast Reliability Matters! FCT Assembly Field Application Engineer, Tony Lentz, and BlueRing Stencils Manager of Stencil Technology, Greg Smith, were recently featured as special guests on this […]
FCT Assembly manufactures and sells high performance lead-free solder pastes for electronics assembly. Read more about our solder paste here.
We’re excited to share that FCT Assembly engineer Tony Lentz has been published in the latest Journal of SMT! “Fill the Void III” is the third in a series* exploring voiding (or gaps) in solder joints between circuit boards and components and expands on how to reduce voiding. Using specially designed circuit boards with components […]
Stencil design files are typically created along with the circuit board designs. The stencil aperture sizes are often the same size as the copper pads (1:1). If solder paste was printed using these aperture sizes, then issues could occur such as solder balling or bridging. It is common practice to reduce the stencil aperture size […]
There are many solderable surface finishes used on printed circuit boards. These surface finishes are necessary to protect the copper pads from oxidation and corrosion. Copper oxidizes very quickly and the oxide thickness grows over time. Copper oxides are very difficult to solder to especially with low activity no-clean fluxes. Solderable surface finishes protect the […]
Solder paste can be made with a variety of solder powder sizes. Solder powder sizes are classified by Type in the IPC standard J-STD-005 Requirements for Soldering Pastes. Table 3-2 details the solder powder size ranges for each type, and an excerpt from the table is shown below*. *IPC J-STD-005A Requirements for Soldering Pastes, […]