How Does Printed Solder Paste Volume Affect Solder Joint Reliability

Stencil design files are typically created along with the circuit board designs.  The stencil aperture sizes are often the same size as the copper pads (1:1). If solder paste was printed using these aperture sizes, then issues could occur such as solder balling or bridging.  It is common practice to reduce the stencil aperture size […]