The Effects of Surface Finish on Solder Paste Performance – the Sequel
Tony Lentz, FCT Solder Field Application Engineer, recently presented at SMTAI. This is a second study on how solderable surface finish affects solder paste performance in the surface mount process. Read his technical paper for recommendations for optimal combinations of surface finish and solder paste.
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LED Solder Assembly
We take a solution-driven approach to all of our products.
With the ability to print at up to 150mm/sec, our no-clean, lead-free solder pastes have become the gold standard for LED applications. For our LED solder materials, we asked:
What if we could eliminate (or dramatically reduce) the chances of thermal voiding for our customers’ products?
About FCT Solder
FCT Solder provides the highest performing chemistries in the market today. We offer many advantages through our solution driven solder products. Explore the various solder products that we offer including solder paste, bar, wire, and flux technology.
FCT’s solder paste line can be defined by many categories: no clean, water soluble, RMA, pin probable versus non pin probable and halogen free versus halide based activation.
But we have broken our product line out by Leaded versus Lead Free. For leaded we sell 63/37, 62/36/2, Hi Temp leaded alloys. Lead free alloys include SAC305, SN100C, SAC387, SAC307 as well as other HMP alloys. These typically come in Type 3 , Type 4 and Type 5 particle sizes.
For our paste products we think that it is important to offer fresh pastes and so paste orders ship within 4 working days. Lastly our strength isn’t just in water soluble or no clean technology but in both. Attributes include:
- Thin viscosity with low slump characteristics
- Halogen free product line with good activity and stability
- Low graping products for both water soluble and no clean
- Antitombstoning alloys that offer a melting range for both leaded and lead free alloys
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