WS159 is a water-soluble, leaded solder paste that is classified ORH0. WS159 was formulated to meet the requirements for reliable solder joints in PCB Assemblies along with a large operating window. Thus, WS159 was designed to provide humidity tolerance and excellent wetting. WS159 remains stable in a wide range of temperatures (65-85F) and relative humidities (25-65%RH). While maintaining a stable viscosity and exceptional cosmetics, WS159 exhibits low voiding characteristics. The residue of this product is easily visible and removable with warm water.
Excellent print volume and repeatability with low area ratios (AR) as low as 0.50 when used with the NanoSlic stencil technology
Environmentally stable formulation which is resistant to slump
Wide reflow window with excellent wetting characteristics on all surface finishes
Very stable product for a water-soluble paste that allows storage of this paste up to 6 months at room temperature and one year if refrigerated
Compatible with either nitrogen or air reflow
Formulated for leaded alloys and Type 3, 4, and 5 solder powders