RMA250 is a high activity, no-clean solder paste that is classified ROL1. This high activity, along with its rosin-based chemistry, allows for improved cosmetics and excellent wetting on all surface finishes. Residues left behind are clear and pin probable but can be removed using the appropriate cleaning chemistry. RMA250 has a wide reflow window with exceptional soldering activity on all surface finishes.
Low viscosity with low slump characteristics allow for fast printing and improved transfer efficiency
Residues can be removed easily with the appropriate cleaning chemistry
Wide reflow window with excellent solderability on various PCB surface finishes
Pin probable with clear post-process residues