AMP Micro is an ultra-fine feature, no-clean and Pb-free solder paste formulated to combat the print and reflow challenges associated with miniaturization in PCB assemblies. This solder paste is designed for use with Type 6 and 7 solder powders, to achieve excellent printability needed for the industry’s smallest packages including 01005 and 008004 Imperial component sizes. This solder paste is specially formulated for excellent coalescence in convection reflow with an air atmosphere.
Attributes:
Formulated to achieve excellent printability through ultra-fine apertures needed to accommodate high density, small pitch PCB designs.
Reflow in air – Enables complete coalescence in convection air at fine deposits down to 4 mils (102 μm).
Best in class voiding performance.
Long lasting stencil life ≥ 6 hours.
High tack that is stable over 72 hours.
Clear, pin-testable flux residue which is halide and halogen-free.
AMP Micro
AMP Micro is an ultra-fine feature, no-clean and Pb-free solder paste formulated to combat the print and reflow challenges associated with miniaturization in PCB assemblies. This solder paste is designed for use with Type 6 and 7 solder powders, to achieve excellent printability needed for the industry’s smallest packages including 01005 and 008004 Imperial component sizes. This solder paste is specially formulated for excellent coalescence in convection reflow with an air atmosphere.
Attributes:
AMP Micro TDS
Description
Product Specifications
Flux Type: No Clean
Halogen Content: Halogen-Free
Lead Content: Lead-Free
Additional information
No Clean
Halogen-Free
Lead-Free
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