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Fill the Void III

This study is part three in a series of papers on voiding in solder joints and methods for mitigation of voids. In this study several new variables were tested and compared to previous data on voiding. A new circuit board design was used which is different than the circuit board used in previous studies. The new circuit board design includes two sizes of QFNs (Quad Flat No Lead), BGA’s (Ball Grid Array), and LGA (Land Grid Array) components which are susceptible to voiding.

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Fill the Void II: An Investigation into Methods of Reducing Voiding

Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to “Fill the Void.” This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.

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Fill the Void

Voids in solder joints are a concern for many electronic manufacturers. They create weakness in the solder joints which can lead to mechanical failure. Voids can slow or limit heat transfer away from the component which can lead to thermal failure. Voids can also interfere with electrical signal flow creating problems with the function of the circuit board. Minimization of voiding is beneficial for the life and function of the circuit assembly.

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