Water Soluble Solder Paste

With the prevailing trend towards no-clean formulations, water soluble solder paste technology has fallen behind no-clean technology, especially for use with lead-free solder alloys. This paper details the research and development of a new water soluble lead-free solder paste that improves on the performance characteristics of existing technologies. Speaker: FCT Field Application Engineer, Tony Lentz

 

Want to learn more or get a sample?