FILL THE VOID III – SOLDER VOIDING SOLUTIONS VIDEO

This study is part three in a series of papers on voiding in solder joints and methods for mitigation of voids. In this study several new variables were tested and compared to previous data on voiding. A new circuit board design was used which is different than the circuit board used in previous studies. The new circuit board design includes two sizes of QFNs (Quad Flat No Lead), BGA’s (Ball Grid Array), and LGA (Land Grid Array) components which are susceptible to voiding.

About Tony Lentz

Tony Lentz has worked in the electronics industry since 1994. He worked as a process engineer at a circuit board manufacturer for 5 years. Over the last 14 years, Tony has worked for FCT as a chemical laboratory manager and facility manager. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Tony has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in Chemistry.

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