Fill the Void IV

Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to “Fill the Void.” This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Speaker: FCT Field Application Engineer, Tony Lentz

About Tony Lentz

Tony Lentz has worked in the electronics industry since 1994. He worked as a process engineer at a circuit board manufacturer for 5 years. Over the last 14 years, Tony has worked for FCT as a chemical laboratory manager and facility manager. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Tony has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in Chemistry.