NC165-S is a low-solids liquid flux for selective and wave solder applications. NC165-S passes Telcordia GR-78 electrochemical migration for high reliability applications. NC165-S has been designed to reduce the potential for clogging of drop-jet flux systems. NC165-S is also compatible with spray and foaming type flux systems. NC165-S works well with leaded and Pb-free alloys and is halide free.
Excellent liquid flux for wave and selective soldering, and touch up or rework.
Low solids content (4% wt) which leaves a clear and colorless residue.
Works well for Sn63/Pb37, SAC305 and SN100C alloys.
Shelf Life: 3 years