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Fill the Void. Save Your Circuits.

Manufacturers are facing a major issue: voiding.
 
Voiding occurs when pockets of gas become trapped within the solder joint during the reflow process. This can lead to a reduction in solder joint reliability, an impedance of thermal transfer, and an increase in mechanical failure. Simply reworking solder joints would be too difficult or time-consuming for complex electronic assemblies and may potentially stress nearby components thermally.
 
There is much debate about how much voiding is acceptable – but one thing’s clear: the fewer voids, the better

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Fill out the form to receive a free download of our white papers to:

 

Learn effective methods 

for minimizing voids.

Understand the reduction 

of voiding on an expanded set of variables.

Discover proven combinations 

of mitigation strategies.

Determine how voiding reduction 

applies to multiple solder pastes.